Polytech CAO » Cadence_Pcb_Librairie

(allegroTechFile "CUST.tech"

(revision "14.0")

(techFileUnits

(altitudeUnits "m")

(capacitanceUnits "pF")

(designUnits "MIL")

(distanceUnits "cm")

(electricalConductivityUnits "mho/cm")

(failureRateUnits "fpmh")

(impedanceUnits "ohm")

(inductanceUnits "nH")

(layerThicknessUnits "mil")

(propagationDelayUnits "ns")

(temperatureUnits "degC")

(thermalConductanceUnits "w/cm-degC")

(thermalConductivityUnits "w/cm-degC")

(velocityUnits "m/s")

(voltageUnits "V")

(noiseVoltageUnits "mV")

(wireResistanceUnits "Ohm")

)

(crossSectionDescriptor

(layer 0

(layerType SURFACE)

(layerMaterial "AIR")

(layerThickness 0)

(layerElectricalConductivity 0)

(layerThermalConductivity 0)

(layerDielectricConstant 1.000000)

)

(layer 1

(layerType CONDUCTOR)

(layerName "TOP")

(layerMaterial "PLATED_COPPER_FOIL")

(layerThickness 2.100000)

(layerElectricalConductivity 343000.00000)

(layerThermalConductivity 2.263000)

(layerDielectricConstant 1.000000)

(layerArtworkNegativeFlag FALSE)

(layerIsShieldFlag FALSE)

)

(layer 2

(layerType DIELECTRIC)

(layerMaterial "FR-4")

(layerThickness 8.000000)

(layerElectricalConductivity 0)

(layerThermalConductivity 0.012)

(layerDielectricConstant 4.500000)

(layerLossTangent 0.035)

)

(layer 3

(layerType CONDUCTOR)

(layerName "BOTTOM")

(layerMaterial "PLATED_COPPER_FOIL")

(layerThickness 2.100000)

(layerElectricalConductivity 343000.00000)

(layerThermalConductivity 2.263000)

(layerDielectricConstant 1.000000)

(layerArtworkNegativeFlag FALSE)

(layerIsShieldFlag FALSE)

)

(layer 4

(layerType SURFACE)

(layerMaterial "AIR")

(layerThickness 0)

(layerElectricalConductivity 0)

(layerThermalConductivity 0)

(layerDielectricConstant 1.000000)

)

)

(techFileConstraint

(globalOpFlags

(physicalOpFlags

(viaList ALWAYS_CHECK)

(physicalLayerGroup "TOP"

(minLineWidth ALWAYS_CHECK)

(minNeckWidth ALWAYS_CHECK)

(maxNeckLength ALWAYS_CHECK)

(minBlindBuriedViaStaggerDistance ALWAYS_CHECK)

(maxBlindBuriedViaStaggerDistance NEVER_CHECK)

(allowOnEtchSubclass ALWAYS_CHECK)

(teesAllowed ALWAYS_CHECK)

(directConnectAllowed NEVER_CHECK)

(maxNumberOfCrossings NEVER_CHECK)

(minDistanceBetweenCrossings NEVER_CHECK)

(minEndSegmentLength NEVER_CHECK)

(maxBondingWireLength NEVER_CHECK)

(minBondingWireLength NEVER_CHECK)

)

(physicalLayerGroup "BOTTOM"

(minLineWidth ALWAYS_CHECK)

(minNeckWidth ALWAYS_CHECK)

(maxNeckLength ALWAYS_CHECK)

(minBlindBuriedViaStaggerDistance ALWAYS_CHECK)

(maxBlindBuriedViaStaggerDistance NEVER_CHECK)

(allowOnEtchSubclass ALWAYS_CHECK)

(teesAllowed ALWAYS_CHECK)

(directConnectAllowed NEVER_CHECK)

(maxNumberOfCrossings NEVER_CHECK)

(minDistanceBetweenCrossings NEVER_CHECK)

(minEndSegmentLength NEVER_CHECK)

(maxBondingWireLength NEVER_CHECK)

(minBondingWireLength NEVER_CHECK)

)

)

(spacingOpFlags

(minBlindBuriedViaGap ALWAYS_CHECK)

(differentialPairLengthTolerance NEVER_CHECK)

(differentialPairSecondaryMaxLength NEVER_CHECK)

(spacingLayerGroup "TOP"

(sameNetCheck ALWAYS_CHECK)

(differentialPairPrimaryMaxSeparation ALWAYS_CHECK)

(differentialPairSecondaryMaxSeparation ALWAYS_CHECK)

(spacing

(blindBuriedViaToBlindBuriedVia ALWAYS_CHECK)

(blindBuriedViaToLine ALWAYS_CHECK)

(blindBuriedViaToSMDPin ALWAYS_CHECK)

(blindBuriedViaToShape ALWAYS_CHECK)

(blindBuriedViaToTestPin ALWAYS_CHECK)

(blindBuriedViaToTestVia ALWAYS_CHECK)

(blindBuriedViaToThruPin ALWAYS_CHECK)

(blindBuriedViaToThruVia ALWAYS_CHECK)

(diagonalWireToDiagonalWire ALWAYS_CHECK)

(diagonalWireToHole ALWAYS_CHECK)

(diagonalWireToOrthogonalWire ALWAYS_CHECK)

(holeToHole ALWAYS_CHECK)

(holeToOrthogonalWire ALWAYS_CHECK)

(lineToLine ALWAYS_CHECK)

(lineToSMDPin ALWAYS_CHECK)

(lineToShape ALWAYS_CHECK)

(lineToTestPin ALWAYS_CHECK)

(lineToTestVia ALWAYS_CHECK)

(lineToThruPin ALWAYS_CHECK)

(lineToThruVia ALWAYS_CHECK)

(orthogonalWireToOrthogonalWire ALWAYS_CHECK)

(shapeToSMDPin ALWAYS_CHECK)

(shapeToShape ALWAYS_CHECK)

(shapeToTestPin ALWAYS_CHECK)

(shapeToTestVia ALWAYS_CHECK)

(shapeToThruPin ALWAYS_CHECK)

(shapeToThruVia ALWAYS_CHECK)

(SMDPinToSMDPin ALWAYS_CHECK)

(SMDPinToTestPin ALWAYS_CHECK)

(SMDPinToTestVia ALWAYS_CHECK)

(SMDPinToThruPin ALWAYS_CHECK)

(SMDPinToThruVia ALWAYS_CHECK)

(testPinToTestPin ALWAYS_CHECK)

(testPinToTestVia ALWAYS_CHECK)

(testPinToThruPin ALWAYS_CHECK)

(testPinToThruVia ALWAYS_CHECK)

(testViaToTestVia ALWAYS_CHECK)

(testViaToThruPin ALWAYS_CHECK)

(testViaToThruVia ALWAYS_CHECK)

(thruPinToThruPin ALWAYS_CHECK)

(thruPinToThruVia ALWAYS_CHECK)

(thruViaToThruVia ALWAYS_CHECK)

(thruPinToBondpad ALWAYS_CHECK)

(SMDPinToBondpad ALWAYS_CHECK)

(thruViaToBondpad ALWAYS_CHECK)

(bondpadToBondpad ALWAYS_CHECK)

(bondpadToLine ALWAYS_CHECK)

(bondpadToShape ALWAYS_CHECK)

(BBViaToBondpad ALWAYS_CHECK)

(testPinToBondpad ALWAYS_CHECK)

(testViaToBondpad ALWAYS_CHECK)

)

)

(spacingLayerGroup "BOTTOM"

(sameNetCheck ALWAYS_CHECK)

(differentialPairPrimaryMaxSeparation ALWAYS_CHECK)

(differentialPairSecondaryMaxSeparation ALWAYS_CHECK)

(spacing

(blindBuriedViaToBlindBuriedVia ALWAYS_CHECK)

(blindBuriedViaToLine ALWAYS_CHECK)

(blindBuriedViaToSMDPin ALWAYS_CHECK)

(blindBuriedViaToShape ALWAYS_CHECK)

(blindBuriedViaToTestPin ALWAYS_CHECK)

(blindBuriedViaToTestVia ALWAYS_CHECK)

(blindBuriedViaToThruPin ALWAYS_CHECK)

(blindBuriedViaToThruVia ALWAYS_CHECK)

(diagonalWireToDiagonalWire ALWAYS_CHECK)

(diagonalWireToHole ALWAYS_CHECK)

(diagonalWireToOrthogonalWire ALWAYS_CHECK)

(holeToHole ALWAYS_CHECK)

(holeToOrthogonalWire ALWAYS_CHECK)

(lineToLine ALWAYS_CHECK)

(lineToSMDPin ALWAYS_CHECK)

(lineToShape ALWAYS_CHECK)

(lineToTestPin ALWAYS_CHECK)

(lineToTestVia ALWAYS_CHECK)

(lineToThruPin ALWAYS_CHECK)

(lineToThruVia ALWAYS_CHECK)

(orthogonalWireToOrthogonalWire ALWAYS_CHECK)

(shapeToSMDPin ALWAYS_CHECK)

(shapeToShape ALWAYS_CHECK)

(shapeToTestPin ALWAYS_CHECK)

(shapeToTestVia ALWAYS_CHECK)

(shapeToThruPin ALWAYS_CHECK)

(shapeToThruVia ALWAYS_CHECK)

(SMDPinToSMDPin ALWAYS_CHECK)

(SMDPinToTestPin ALWAYS_CHECK)

(SMDPinToTestVia ALWAYS_CHECK)

(SMDPinToThruPin ALWAYS_CHECK)

(SMDPinToThruVia ALWAYS_CHECK)

(testPinToTestPin ALWAYS_CHECK)

(testPinToTestVia ALWAYS_CHECK)

(testPinToThruPin ALWAYS_CHECK)

(testPinToThruVia ALWAYS_CHECK)

(testViaToTestVia ALWAYS_CHECK)

(testViaToThruPin ALWAYS_CHECK)

(testViaToThruVia ALWAYS_CHECK)

(thruPinToThruPin ALWAYS_CHECK)

(thruPinToThruVia ALWAYS_CHECK)

(thruViaToThruVia ALWAYS_CHECK)

(thruPinToBondpad ALWAYS_CHECK)

(SMDPinToBondpad ALWAYS_CHECK)

(thruViaToBondpad ALWAYS_CHECK)

(bondpadToBondpad ALWAYS_CHECK)

(bondpadToLine ALWAYS_CHECK)

(bondpadToShape ALWAYS_CHECK)

(BBViaToBondpad ALWAYS_CHECK)

(testPinToBondpad ALWAYS_CHECK)

(testViaToBondpad ALWAYS_CHECK)

)

)

)

(electricalOpFlags

(impedance ALWAYS_CHECK)

(maxStubLength ALWAYS_CHECK)

(scheduleVerify ALWAYS_CHECK)

(maxViaCount ALWAYS_CHECK)

(maxExposedLength ALWAYS_CHECK)

(maxOvershoot ALWAYS_CHECK)

(maxXtalk ALWAYS_CHECK)

(maxPeakXtalk ALWAYS_CHECK)

(maxSSN ALWAYS_CHECK)

(minNoiseMargin ALWAYS_CHECK)

(minFirstSwitchTime ALWAYS_CHECK)

(maxFinalSettleTime ALWAYS_CHECK)

(maxNetParallelism ALWAYS_CHECK)

(propagationDelay ALWAYS_CHECK)

(relativePropagationDelay ALWAYS_CHECK)

(TotalEtchLength ALWAYS_CHECK)

(XtalkTimingWindowDescriptor

(XtalkActiveTimes ALWAYS_CHECK)

(XtalkSensitiveTimes ALWAYS_CHECK)

)

)

)

(physicalSetName "C1"

(lockFlag OFF)

(viaList "VIA" "C_VIA")

(physicalLayerGroup "TOP"

(minLineWidth 20)

(minNeckWidth 20)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

(physicalLayerGroup "BOTTOM"

(minLineWidth 20)

(minNeckWidth 20)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

)

(physicalSetName "C2"

(lockFlag OFF)

(viaList "VIA" "C_VIA")

(physicalLayerGroup "TOP"

(minLineWidth 16)

(minNeckWidth 16)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

(physicalLayerGroup "BOTTOM"

(minLineWidth 16)

(minNeckWidth 16)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

)

(physicalSetName "C3"

(lockFlag OFF)

(viaList "VIA" "C_VIA")

(physicalLayerGroup "TOP"

(minLineWidth 12)

(minNeckWidth 12)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

(physicalLayerGroup "BOTTOM"

(minLineWidth 12)

(minNeckWidth 12)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

)

(physicalSetName "C4"

(lockFlag OFF)

(viaList "VIA" "C_VIA")

(physicalLayerGroup "TOP"

(minLineWidth 8)

(minNeckWidth 8)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

(physicalLayerGroup "BOTTOM"

(minLineWidth 8)

(minNeckWidth 8)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

)

(physicalSetName "DEFAULT"

(lockFlag OFF)

(viaList "VIA" "C_VIA")

(physicalLayerGroup "TOP"

(minLineWidth 12)

(minNeckWidth 8)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

(physicalLayerGroup "BOTTOM"

(minLineWidth 12)

(minNeckWidth 8)

(maxNeckLength 500)

(minBlindBuriedViaStaggerDistance 5)

(maxBlindBuriedViaStaggerDistance 0)

(allowOnEtchSubclass TRUE)

(teesAllowed ANYWHERE)

(directConnectAllowed ALL_ALLOWED)

(maxNumberOfCrossings 0)

(minDistanceBetweenCrossings 0)

(minEndSegmentLength 0)

(maxBondingWireLength 0)

(minBondingWireLength 0)

)

)

(spacingSetName "C1"

(lockFlag OFF)

(minBlindBuriedViaGap 5)

(differentialPairLengthTolerance "")

(differentialPairSecondaryMaxLength 0)

(spacingLayerGroup "TOP"

(sameNetCheck FALSE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 20)

(blindBuriedViaToLine 20)

(blindBuriedViaToSMDPin 20)

(blindBuriedViaToShape 20)

(blindBuriedViaToTestPin 20)

(blindBuriedViaToTestVia 20)

(blindBuriedViaToThruPin 20)

(blindBuriedViaToThruVia 20)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 20)

(lineToSMDPin 20)

(lineToShape 20)

(lineToTestPin 20)

(lineToTestVia 20)

(lineToThruPin 20)

(lineToThruVia 20)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 20)

(shapeToShape 20)

(shapeToTestPin 20)

(shapeToTestVia 20)

(shapeToThruPin 20)

(shapeToThruVia 20)

(SMDPinToSMDPin 20)

(SMDPinToTestPin 20)

(SMDPinToTestVia 20)

(SMDPinToThruPin 20)

(SMDPinToThruVia 20)

(testPinToTestPin 20)

(testPinToTestVia 20)

(testPinToThruPin 20)

(testPinToThruVia 20)

(testViaToTestVia 20)

(testViaToThruPin 20)

(testViaToThruVia 20)

(thruPinToThruPin 20)

(thruPinToThruVia 20)

(thruViaToThruVia 20)

(thruPinToBondpad 20)

(SMDPinToBondpad 20)

(thruViaToBondpad 20)

(bondpadToBondpad 20)

(bondpadToLine 20)

(bondpadToShape 20)

(BBViaToBondpad 20)

(testPinToBondpad 20)

(testViaToBondpad 20)

)

)

(spacingLayerGroup "BOTTOM"

(sameNetCheck FALSE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 20)

(blindBuriedViaToLine 20)

(blindBuriedViaToSMDPin 20)

(blindBuriedViaToShape 20)

(blindBuriedViaToTestPin 20)

(blindBuriedViaToTestVia 20)

(blindBuriedViaToThruPin 20)

(blindBuriedViaToThruVia 20)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 20)

(lineToSMDPin 20)

(lineToShape 20)

(lineToTestPin 20)

(lineToTestVia 20)

(lineToThruPin 20)

(lineToThruVia 20)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 20)

(shapeToShape 20)

(shapeToTestPin 20)

(shapeToTestVia 20)

(shapeToThruPin 20)

(shapeToThruVia 20)

(SMDPinToSMDPin 20)

(SMDPinToTestPin 20)

(SMDPinToTestVia 20)

(SMDPinToThruPin 20)

(SMDPinToThruVia 20)

(testPinToTestPin 20)

(testPinToTestVia 20)

(testPinToThruPin 20)

(testPinToThruVia 20)

(testViaToTestVia 20)

(testViaToThruPin 20)

(testViaToThruVia 20)

(thruPinToThruPin 20)

(thruPinToThruVia 20)

(thruViaToThruVia 20)

(thruPinToBondpad 20)

(SMDPinToBondpad 20)

(thruViaToBondpad 20)

(bondpadToBondpad 20)

(bondpadToLine 20)

(bondpadToShape 20)

(BBViaToBondpad 20)

(testPinToBondpad 20)

(testViaToBondpad 20)

)

)

)

(spacingSetName "C2"

(lockFlag OFF)

(minBlindBuriedViaGap 5)

(differentialPairLengthTolerance "")

(differentialPairSecondaryMaxLength 0)

(spacingLayerGroup "TOP"

(sameNetCheck FALSE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 16)

(blindBuriedViaToLine 16)

(blindBuriedViaToSMDPin 16)

(blindBuriedViaToShape 16)

(blindBuriedViaToTestPin 16)

(blindBuriedViaToTestVia 16)

(blindBuriedViaToThruPin 16)

(blindBuriedViaToThruVia 16)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 16)

(lineToSMDPin 16)

(lineToShape 16)

(lineToTestPin 16)

(lineToTestVia 16)

(lineToThruPin 16)

(lineToThruVia 16)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 16)

(shapeToShape 16)

(shapeToTestPin 16)

(shapeToTestVia 16)

(shapeToThruPin 16)

(shapeToThruVia 16)

(SMDPinToSMDPin 16)

(SMDPinToTestPin 16)

(SMDPinToTestVia 16)

(SMDPinToThruPin 16)

(SMDPinToThruVia 16)

(testPinToTestPin 16)

(testPinToTestVia 16)

(testPinToThruPin 16)

(testPinToThruVia 16)

(testViaToTestVia 16)

(testViaToThruPin 16)

(testViaToThruVia 16)

(thruPinToThruPin 16)

(thruPinToThruVia 16)

(thruViaToThruVia 16)

(thruPinToBondpad 16)

(SMDPinToBondpad 16)

(thruViaToBondpad 16)

(bondpadToBondpad 16)

(bondpadToLine 16)

(bondpadToShape 16)

(BBViaToBondpad 16)

(testPinToBondpad 16)

(testViaToBondpad 16)

)

)

(spacingLayerGroup "BOTTOM"

(sameNetCheck FALSE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 16)

(blindBuriedViaToLine 16)

(blindBuriedViaToSMDPin 16)

(blindBuriedViaToShape 16)

(blindBuriedViaToTestPin 16)

(blindBuriedViaToTestVia 16)

(blindBuriedViaToThruPin 16)

(blindBuriedViaToThruVia 16)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 16)

(lineToSMDPin 16)

(lineToShape 16)

(lineToTestPin 16)

(lineToTestVia 16)

(lineToThruPin 16)

(lineToThruVia 16)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 16)

(shapeToShape 16)

(shapeToTestPin 16)

(shapeToTestVia 16)

(shapeToThruPin 16)

(shapeToThruVia 16)

(SMDPinToSMDPin 16)

(SMDPinToTestPin 16)

(SMDPinToTestVia 16)

(SMDPinToThruPin 16)

(SMDPinToThruVia 16)

(testPinToTestPin 16)

(testPinToTestVia 16)

(testPinToThruPin 16)

(testPinToThruVia 16)

(testViaToTestVia 16)

(testViaToThruPin 16)

(testViaToThruVia 16)

(thruPinToThruPin 16)

(thruPinToThruVia 16)

(thruViaToThruVia 16)

(thruPinToBondpad 16)

(SMDPinToBondpad 16)

(thruViaToBondpad 16)

(bondpadToBondpad 16)

(bondpadToLine 16)

(bondpadToShape 16)

(BBViaToBondpad 16)

(testPinToBondpad 16)

(testViaToBondpad 16)

)

)

)

(spacingSetName "C4"

(lockFlag OFF)

(minBlindBuriedViaGap 5)

(differentialPairLengthTolerance "")

(differentialPairSecondaryMaxLength 0)

(spacingLayerGroup "TOP"

(sameNetCheck FALSE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 8)

(blindBuriedViaToLine 8)

(blindBuriedViaToSMDPin 8)

(blindBuriedViaToShape 8)

(blindBuriedViaToTestPin 8)

(blindBuriedViaToTestVia 8)

(blindBuriedViaToThruPin 8)

(blindBuriedViaToThruVia 8)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 8)

(lineToSMDPin 8)

(lineToShape 8)

(lineToTestPin 8)

(lineToTestVia 8)

(lineToThruPin 8)

(lineToThruVia 8)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 8)

(shapeToShape 8)

(shapeToTestPin 8)

(shapeToTestVia 8)

(shapeToThruPin 8)

(shapeToThruVia 8)

(SMDPinToSMDPin 8)

(SMDPinToTestPin 8)

(SMDPinToTestVia 8)

(SMDPinToThruPin 8)

(SMDPinToThruVia 8)

(testPinToTestPin 8)

(testPinToTestVia 8)

(testPinToThruPin 8)

(testPinToThruVia 8)

(testViaToTestVia 8)

(testViaToThruPin 8)

(testViaToThruVia 8)

(thruPinToThruPin 8)

(thruPinToThruVia 8)

(thruViaToThruVia 8)

(thruPinToBondpad 8)

(SMDPinToBondpad 8)

(thruViaToBondpad 8)

(bondpadToBondpad 8)

(bondpadToLine 8)

(bondpadToShape 8)

(BBViaToBondpad 8)

(testPinToBondpad 8)

(testViaToBondpad 8)

)

)

(spacingLayerGroup "BOTTOM"

(sameNetCheck FALSE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 8)

(blindBuriedViaToLine 8)

(blindBuriedViaToSMDPin 8)

(blindBuriedViaToShape 8)

(blindBuriedViaToTestPin 8)

(blindBuriedViaToTestVia 8)

(blindBuriedViaToThruPin 8)

(blindBuriedViaToThruVia 8)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 8)

(lineToSMDPin 8)

(lineToShape 8)

(lineToTestPin 8)

(lineToTestVia 8)

(lineToThruPin 8)

(lineToThruVia 8)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 8)

(shapeToShape 8)

(shapeToTestPin 8)

(shapeToTestVia 8)

(shapeToThruPin 8)

(shapeToThruVia 8)

(SMDPinToSMDPin 8)

(SMDPinToTestPin 8)

(SMDPinToTestVia 8)

(SMDPinToThruPin 8)

(SMDPinToThruVia 8)

(testPinToTestPin 8)

(testPinToTestVia 8)

(testPinToThruPin 8)

(testPinToThruVia 8)

(testViaToTestVia 8)

(testViaToThruPin 8)

(testViaToThruVia 8)

(thruPinToThruPin 8)

(thruPinToThruVia 8)

(thruViaToThruVia 8)

(thruPinToBondpad 8)

(SMDPinToBondpad 8)

(thruViaToBondpad 8)

(bondpadToBondpad 8)

(bondpadToLine 8)

(bondpadToShape 8)

(BBViaToBondpad 8)

(testPinToBondpad 8)

(testViaToBondpad 8)

)

)

)

(spacingSetName "C3"

(lockFlag OFF)

(minBlindBuriedViaGap 5)

(differentialPairLengthTolerance "")

(differentialPairSecondaryMaxLength 0)

(spacingLayerGroup "TOP"

(sameNetCheck FALSE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 12)

(blindBuriedViaToLine 12)

(blindBuriedViaToSMDPin 12)

(blindBuriedViaToShape 12)

(blindBuriedViaToTestPin 12)

(blindBuriedViaToTestVia 12)

(blindBuriedViaToThruPin 12)

(blindBuriedViaToThruVia 12)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 12)

(lineToSMDPin 12)

(lineToShape 12)

(lineToTestPin 12)

(lineToTestVia 12)

(lineToThruPin 12)

(lineToThruVia 12)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 12)

(shapeToShape 12)

(shapeToTestPin 12)

(shapeToTestVia 12)

(shapeToThruPin 12)

(shapeToThruVia 12)

(SMDPinToSMDPin 12)

(SMDPinToTestPin 12)

(SMDPinToTestVia 12)

(SMDPinToThruPin 12)

(SMDPinToThruVia 12)

(testPinToTestPin 12)

(testPinToTestVia 12)

(testPinToThruPin 12)

(testPinToThruVia 12)

(testViaToTestVia 12)

(testViaToThruPin 12)

(testViaToThruVia 12)

(thruPinToThruPin 12)

(thruPinToThruVia 12)

(thruViaToThruVia 12)

(thruPinToBondpad 12)

(SMDPinToBondpad 12)

(thruViaToBondpad 12)

(bondpadToBondpad 12)

(bondpadToLine 12)

(bondpadToShape 12)

(BBViaToBondpad 12)

(testPinToBondpad 12)

(testViaToBondpad 12)

)

)

(spacingLayerGroup "BOTTOM"

(sameNetCheck FALSE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 12)

(blindBuriedViaToLine 12)

(blindBuriedViaToSMDPin 12)

(blindBuriedViaToShape 12)

(blindBuriedViaToTestPin 12)

(blindBuriedViaToTestVia 12)

(blindBuriedViaToThruPin 12)

(blindBuriedViaToThruVia 12)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 12)

(lineToSMDPin 12)

(lineToShape 12)

(lineToTestPin 12)

(lineToTestVia 12)

(lineToThruPin 12)

(lineToThruVia 12)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 12)

(shapeToShape 12)

(shapeToTestPin 12)

(shapeToTestVia 12)

(shapeToThruPin 12)

(shapeToThruVia 12)

(SMDPinToSMDPin 12)

(SMDPinToTestPin 12)

(SMDPinToTestVia 12)

(SMDPinToThruPin 12)

(SMDPinToThruVia 12)

(testPinToTestPin 12)

(testPinToTestVia 12)

(testPinToThruPin 12)

(testPinToThruVia 12)

(testViaToTestVia 12)

(testViaToThruPin 12)

(testViaToThruVia 12)

(thruPinToThruPin 12)

(thruPinToThruVia 12)

(thruViaToThruVia 12)

(thruPinToBondpad 12)

(SMDPinToBondpad 12)

(thruViaToBondpad 12)

(bondpadToBondpad 12)

(bondpadToLine 12)

(bondpadToShape 12)

(BBViaToBondpad 12)

(testPinToBondpad 12)

(testViaToBondpad 12)

)

)

)

(spacingSetName "DEFAULT"

(lockFlag OFF)

(minBlindBuriedViaGap 5)

(differentialPairLengthTolerance "")

(differentialPairSecondaryMaxLength 0)

(spacingLayerGroup "TOP"

(sameNetCheck TRUE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 12)

(blindBuriedViaToLine 12)

(blindBuriedViaToSMDPin 12)

(blindBuriedViaToShape 12)

(blindBuriedViaToTestPin 12)

(blindBuriedViaToTestVia 12)

(blindBuriedViaToThruPin 12)

(blindBuriedViaToThruVia 12)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 12)

(lineToSMDPin 12)

(lineToShape 12)

(lineToTestPin 12)

(lineToTestVia 12)

(lineToThruPin 12)

(lineToThruVia 12)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 12)

(shapeToShape 12)

(shapeToTestPin 12)

(shapeToTestVia 12)

(shapeToThruPin 12)

(shapeToThruVia 12)

(SMDPinToSMDPin 12)

(SMDPinToTestPin 12)

(SMDPinToTestVia 12)

(SMDPinToThruPin 12)

(SMDPinToThruVia 12)

(testPinToTestPin 12)

(testPinToTestVia 12)

(testPinToThruPin 12)

(testPinToThruVia 12)

(testViaToTestVia 12)

(testViaToThruPin 12)

(testViaToThruVia 12)

(thruPinToThruPin 12)

(thruPinToThruVia 12)

(thruViaToThruVia 12)

(thruPinToBondpad 12)

(SMDPinToBondpad 12)

(thruViaToBondpad 12)

(bondpadToBondpad 12)

(bondpadToLine 12)

(bondpadToShape 12)

(BBViaToBondpad 12)

(testPinToBondpad 12)

(testViaToBondpad 12)

)

)

(spacingLayerGroup "BOTTOM"

(sameNetCheck TRUE)

(differentialPairPrimaryMaxSeparation 0)

(differentialPairSecondaryMaxSeparation 0)

(spacing

(blindBuriedViaToBlindBuriedVia 12)

(blindBuriedViaToLine 12)

(blindBuriedViaToSMDPin 12)

(blindBuriedViaToShape 12)

(blindBuriedViaToTestPin 12)

(blindBuriedViaToTestVia 12)

(blindBuriedViaToThruPin 12)

(blindBuriedViaToThruVia 12)

(diagonalWireToDiagonalWire 5)

(diagonalWireToHole 5)

(diagonalWireToOrthogonalWire 5)

(holeToHole 5)

(holeToOrthogonalWire 5)

(lineToLine 12)

(lineToSMDPin 12)

(lineToShape 12)

(lineToTestPin 12)

(lineToTestVia 12)

(lineToThruPin 12)

(lineToThruVia 12)

(orthogonalWireToOrthogonalWire 5)

(shapeToSMDPin 12)

(shapeToShape 12)

(shapeToTestPin 12)

(shapeToTestVia 12)

(shapeToThruPin 12)

(shapeToThruVia 12)

(SMDPinToSMDPin 12)

(SMDPinToTestPin 12)

(SMDPinToTestVia 12)

(SMDPinToThruPin 12)

(SMDPinToThruVia 12)

(testPinToTestPin 12)

(testPinToTestVia 12)

(testPinToThruPin 12)

(testPinToThruVia 12)

(testViaToTestVia 12)

(testViaToThruPin 12)

(testViaToThruVia 12)

(thruPinToThruPin 12)

(thruPinToThruVia 12)

(thruViaToThruVia 12)

(thruPinToBondpad 12)

(SMDPinToBondpad 12)

(thruViaToBondpad 12)

(bondpadToBondpad 12)

(bondpadToLine 12)

(bondpadToShape 12)

(BBViaToBondpad 12)

(testPinToBondpad 12)

(testViaToBondpad 12)

)

)

)

)

)